Intel Names New Foundry Leader

<p><strong>SANTA CLARA<&sol;strong> — Intel Corporation has appointed Seok-Hee Lee &lbrack;photo above&rsqb; as executive vice president of Intel Foundry&comma; reporting directly to CEO Lip-Bu Tan&period; In this role&comma; Lee will lead all advanced packaging&comma; system integration&comma; back-end technology development&comma; and back-end manufacturing&comma; strengthening Intel’s ability to deliver differentiated&comma; system-level innovation for customers&period;<&sol;p>&NewLine;<p>As part of the evolution of the Intel Foundry strategy&comma; the company is establishing advanced packaging as a focused business with dedicated leadership&period; This reflects the growing importance and complexity of packaging as a key enabler of performance&comma; power efficiency&comma; and heterogeneous integration across AI systems&period;<&sol;p>&NewLine;<p>&OpenCurlyDoubleQuote;Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems&comma;” said Lip-Bu Tan&comma; Intel CEO&period; &OpenCurlyDoubleQuote;Seok-Hee brings deep expertise in leading complex&comma; high-scale technology and manufacturing organizations&comma; along with a strong track record of operational execution&period; Seok-Hee’s insights will help Intel further strengthen our system integration capabilities&comma; allowing us to tightly couple leading-edge logic&comma; memory&comma; networking&comma; and other components to build high-performance computing systems for Intel Foundry customers&period; He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies&comma; including EMIB-T and HBI&comma; to high volume for customers and partners&period;”<&sol;p>&NewLine;<p>Lee joins Intel from SK On&comma; where he served as president and CEO&comma; and previously served as president and CEO of SK hynix&period; A semiconductor veteran&comma; he has also held engineering leadership roles at Intel and in academia&comma; bringing deep expertise in advanced process technologies and large-scale manufacturing&period;<&sol;p>&NewLine;<p>&OpenCurlyDoubleQuote;Intel is uniquely positioned to lead in advanced packaging as demand for system-level integration accelerates across AI and high-performance computing&comma;” said Lee&period; &OpenCurlyDoubleQuote;I’m excited to return home and to join the Intel team as we help advance the company’s technology leadership&comma; manufacturing capabilities&comma; and customer commitments in this critical area&period;”<&sol;p>&NewLine;<p>With this change&comma; Naga Chandrasekaran&comma; executive vice president of Intel Foundry&comma; will continue to report to CEO Lip-Bu Tan and lead front-end technology development and front-end manufacturing as the company focuses on accelerating the ramp of Intel 18A&comma; Intel 14A&comma; and future technologies&period; He will also continue to oversee design enablement and end-to-end customer-facing and business enablement functions that support Intel Foundry’s growth&period; This new focused and scalable operating model reinforces Intel’s commitment to strengthening its technology development and manufacturing engine&comma; giving customers and partners greater confidence in Intel’s ability to deliver with speed&comma; consistency&comma; and predictability&period;<&sol;p>&NewLine;<p>As part of the announcement&comma; Intel also shared that executive vice president Navid Shahriari will be retiring after a 37-year career at the company&period;<&sol;p>&NewLine;