DreamBig Scores $75 Million Round

<p><strong><span class&equals;"legendSpanClass"><span class&equals;"xn-location">SAN JOSE <&sol;span><&sol;span><&sol;strong>&&num;8212&semi; DreamBig Semiconductor Inc&period;&comma; a developer of high-performance accelerator platforms utilizing its industry-leading Chiplet Hub with 3D HBM&comma;has scored a <span class&equals;"xn-money">&dollar;75 million<&sol;span> equity funding round&period; This round was co-led by the Samsung Catalyst Fund and the Sutardja Family&period; New investors include Samsung&comma; Hanwha Next Generation Opportunity Fund&comma; Event Horizon&comma; and Raptor&comma; alongside continuing contributions from existing stakeholders including the Sutardja Family&comma; UMC Capital&comma; BRV&comma; Ignite Innovation Fund&comma; Grandfull Fund&comma; amongst others&period;<&sol;p>&NewLine;<p>These funds will bolster the development and commercialization of products built on DreamBig&&num;8217&semi;s Chiplet Hub and Platform Chiplets&period; &&num;8220&semi;This investment underscores the market&&num;8217&semi;s recognition of DreamBig as a transformative force in AI and data center infrastructure&comma;&&num;8221&semi; said <span class&equals;"xn-person">Sohail Syed<&sol;span>&comma; Co-founder and CEO of DreamBig&period; &&num;8220&semi;Our open MARS Chiplet Platform enables unparalleled scale-up and scale-out solutions so customers can achieve the highest levels of performance and energy efficiency at lowest cost and fastest time-to-market&period;&&num;8221&semi;<&sol;p>&NewLine;<p>&&num;8220&semi;We are delighted to co-lead DreamBig&&num;8217&semi;s Series B round and partner with an exceptional team leading the path to streamline chiplet-based AI solutions&comma;&&num;8221&semi; said <span class&equals;"xn-person">Marco Chisari<&sol;span>&comma; Head of Samsung Semiconductor Innovation Center and Executive Vice President&comma; Samsung Electronics&period; &&num;8220&semi;The ever-growing demands for intensive workloads and memory-bound applications – from generative AI to automotive – are fueling the need for more advanced chiplet-based designs with 3D HBM stacking&period;&&num;8221&semi;<&sol;p>&NewLine;<p>The Chiplet Hub and Networking Chiplets deliver highly differentiated capabilities&colon;<&sol;p>&NewLine;<ul>&NewLine;<li>Universal architecture support for CPU&comma; AI&comma; Accelerators&comma; IO&comma; Networking&comma; and Memory Chiplets within a unified platform<&sol;li>&NewLine;<li>Memory-First Architecture for direct access from all chiplets to 3D stacked HBM&comma; DDR&comma; CXL&comma; and SSD memory tiers<&sol;li>&NewLine;<li><a href&equals;"https&colon;&sol;&sol;c212&period;net&sol;c&sol;link&sol;&quest;t&equals;0&amp&semi;l&equals;en&amp&semi;o&equals;4211783-1&amp&semi;h&equals;462101810&amp&semi;u&equals;https&percnt;3A&percnt;2F&percnt;2Fwww&period;flctechgroup&period;com&percnt;2F&amp&semi;a&equals;FLC&plus;Technology" target&equals;"&lowbar;blank" rel&equals;"nofollow noopener">FLC Technology<&sol;a> Group fully associative hardware acceleration for Cache&sol;Memory management<&sol;li>&NewLine;<li>DMA hardware for efficient memory data transfer from any source to any destination managed by the Chiplet Hub<&sol;li>&NewLine;<li>Virtual PCIe&sol;CXL switch for optimized resource allocation<&sol;li>&NewLine;<li>Ethernet&sol;UEC RDMA hardware for enhanced scalability<&sol;li>&NewLine;<li>Multi-Gigabit&comma; low power Content Addressable Memory  for precision Match&sol;Action processing at 800Gbps<&sol;li>&NewLine;<&sol;ul>&NewLine;<p>&&num;8220&semi;We are extremely proud of DreamBig&&num;8217&semi;s accomplishments and its open MARS Chiplet platform with world leading Chiplet Hub for scale-up and Networking IO Chiplets for scale-out enables customers to compose the most advanced AI solutions with UCIe&sol;BoW compliant Chiplets leveraging <a href&equals;"https&colon;&sol;&sol;c212&period;net&sol;c&sol;link&sol;&quest;t&equals;0&amp&semi;l&equals;en&amp&semi;o&equals;4211783-1&amp&semi;h&equals;941410088&amp&semi;u&equals;https&percnt;3A&percnt;2F&percnt;2Fwww&period;silicon-box&period;com&percnt;2F&amp&semi;a&equals;Silicon&plus;Box" target&equals;"&lowbar;blank" rel&equals;"nofollow noopener">Silicon Box<&sol;a> Panel Level Packaging for the masses&&num;8221&semi;&comma;  said Sehat Sutardja and Weili Dai&comma; Co-founders and Chairman&sol;Chairwoman of DreamBig&period; &&num;8220&semi;It is our passion and determination to drive innovation by offering the most advanced technology for the new era of semiconductor Chiplet solutions globally&period; In the last several years&comma; we have cofounded and invested in numerous companies to develop disruptive technologies which DreamBig has leveraged to lead the pack for the new Chiplet era&period;&&num;8221&semi;<&sol;p>&NewLine;