Dr. Malcolm Thompson, executive director of NextFlex, commented, “In just a year since NextFlex was announced, we have signed on 46 members, issued two project calls totaling more than $45 million with 60% cost shared by members and funding from various states. And, equally exciting, is that our flexible hybrid electronics headquarters facility and pilot manufacturing line is open. The collaborative work of NextFlex and our members at this facility will allow companies in Silicon Valley and throughout the U.S. to leap-frog the barriers of cost and integration, and create a viable ecosystem that will enable a new era.”
Known for its start-up mentality and agile business model, NextFlex serves as a catalyst for collaboration and innovation among a collection of companies, academic and nonprofit institutions and government organizations from across the U.S., all focused on creating a robust FHE manufacturing infrastructure. NextFlex’s 34,000 square foot facility located in the heart of Silicon Valley will feature a state-of-the-art class 10,000 pilot manufacturing line in addition to laboratory space—all dedicated to the production of this burgeoning technology.
Approximately 40 companies such as Acellent, American Semiconductor, Boeing, Brewer Science, DuPont, E Ink, GE Global Research, HP Enterprise, i3 Electronics, Jabil, NASA, PARC, Uniqarta together with academia like Berkeley, Binghamton, Cal Poly, Purdue, Univ. of Mass. (Amherst and Lowell), UofA, have showcased their advancements in bringing this exciting technology to fruition at the grand opening last month.