Lumentum Announces Optical Interconnection Breakthrough

<p><span class&equals;"bw-dateline-wrapper"><strong>SAN JOSE<&sol;strong> &&num;8212&semi; <&sol;span>Lumentum Holdings Inc&period;&comma; a global leader in photonic solutions&comma; has announced a breakthrough optical interconnect solution designed to support next-generation AI infrastructure using VCSEL technology&period; This solution offers a scalable optical platform for next-generation rack-level architectures to address the bandwidth&comma; power&comma; and integration challenges of AI scale-up networks&period;<&sol;p>&NewLine;<p>The solution is presented in a host evaluation system and features a high-density multimode 1060nm VCSEL array co-packaged with a host ASIC&comma; targeting &OpenCurlyDoubleQuote;slow and wide” scale-up protocols such as UCIe and PCIe&period; It is implemented in a fan-out wafer-level package&comma; leveraging standard semiconductor packaging flows&comma; and advanced multimode fiber connectivity&period;<&sol;p>&NewLine;<p>The 1060nm VCSELs and photodetectors are integrated in a two-dimensional monolithic array incorporating backside lens technology to enable precise optical alignment and superior signal integrity&period; The array architecture also supports channel sparing for enhanced system reliability&period; Designed for demanding environments&comma; the platform supports high-temperature operation exceeding 150°C and leverages the inherent reliability advantages of 1060nm VCSEL technology&period;<&sol;p>&NewLine;<p>Lumentum’s 1060nm VCSEL platform is built on the company’s ultra-high-volume 3D sensing &lpar;3DS&rpar; manufacturing base&comma; which has shipped more than 10 billion emitters to date&period; Compared to conventional 850nm datacom VCSELs&comma; 1060nm devices deliver improved speed capability&comma; superior high-temperature performance&comma; and exceptional long-term reliability&period; As a VCSEL-based scale-up solution&comma; the platform also provides an independent supply chain alternative to silicon photonics and InP laser-based architectures&period;<&sol;p>&NewLine;<p>&OpenCurlyDoubleQuote;AI infrastructure is pushing the limits of conventional electrical interconnects&comma;” said Matt Sysak&comma; Chief Technology Officer at Lumentum&period; &OpenCurlyDoubleQuote;Our 1060nm VCSEL scale-up platform optically enables ASICs with high shoreline bandwidth density&comma; strong signal integrity&comma; and thermal resilience&comma; while providing a differentiated and highly reliable alternative to traditional silicon photonics-based approaches&period;”<&sol;p>&NewLine;